光联芯科
芯片
光联芯科以微环硅光路线研发芯片级光互连，面向 AI 集群日益增长的数据传输需求。近封装光学引擎与精密波长修调工艺，是其从研究走向可制造产品的重点。
LIGHTLINK pursues chip-level optical interconnects through microring silicon photonics. Near-package optical engines and precise wavelength tuning are central to serving the growing data-transfer demands of AI clusters.
